Microstructure and Orientation Evolution of Unidirectional Solidification Pure Copper during ECAP
Microstructure and Orientation Evolution of Unidirectional Solidification Pure Copper during ECAP
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发表时间：
2011-10
影响因子：
0.7
通讯作者：
Guo Tingbiao;Ding Yutian;Yuan Xun-Feng;Hu Yong
中科院分区：
文献类型：
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作者：
Guo Tingbiao;Ding Yutian;Yuan Xun-Feng;Hu Yong
采用路线C对ECAP过程中单向凝固纯铜进行了实验，并对样品进行了XRD和EBSD研究。结果表明，随着应变的增加，原始微观结构对亚晶取向的影响逐渐减小。低应变时，柱晶内部首先形成取向与基体差异较大的能带结构。随着应变的增加，能带结构的边界向两侧扩展，将原来的柱状晶逐渐分割成亚晶，亚晶的分布具有方向性分布特征，并且亚晶中出现孪晶。继续增加应变，原有晶界开始破碎，小角度晶界和大角度晶界同时出现，呈现扩散分布特征。
Experiment were conducted to unidirectional solidification pure copper during ECAP by route C, the samples were investigated by XRD and EBSD. The results shown that the effect of original microstructure on the subgrains orientation decrease with the increasing of strain. At low strain, in the column grain interiors first formed a band structure that the orientation quite different with the matrix. With the strain increasing, the boundaries of the band structure expanding towards to two sides, gradually partition the original column grains into subgrains, the distribution of the subgrains possesses a directional distribution characteristics and the twins occurring in subgrains. Keep on increasing strain, the original grain boundaries began to broken, low angles grain boundaries and high angles grain boundaries both occur simultaneously shows a diffusion distribution characteristics.