Efficient micro machining with high average power picosecond lasers
Efficient micro machining with high average power picosecond lasers
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使用高平均功率皮秒激光器进行高效微加工
DOI：
10.1117/12.761770
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发表时间：
2008
期刊：
影响因子：
--
通讯作者：
B. Faisst
中科院分区：
文献类型：
--
作者：
S. Weiler;U. Stute;S. Massa;S. Buettner;B. Faisst
皮秒脉冲非常适用于必须将热影响降至最低的材料加工。此外，对于ps脉冲持续时间，可以大大简化产生脉冲的技术方法，允许在1030 nm的基本波长下平均输出功率为50W。我们报告了高效微加工的最新结果。基础研究表明，测量的烧蚀阈值最方便的材料(即铁，SS，铝，铜，黄铜，硅，镍等)。以及从所谓的光烧蚀到热烧蚀的测量转变。利用这些结果，我们优化了微细加工工艺，如切割、钻孔和PS脉冲烧蚀薄膜。
Picosecond pulses are ideal for processing of materials where thermal influence must be minimized. Furthermore, for ps pulse durations, the technical approach to generating the pulses can be greatly simplified, allowing average output powers of 50 W at the fundamental wavelength of 1030 nm. We report on the latest results for efficient micro machining. Fundamental investigations show the measured ablation thresholds for the most convenient materials (i.e. Fe, SS, Al, Cu, Brass, Si, NiTi, etc.) and the measured transition from so called optical ablation to thermal ablation. By using these results we optimized micro machining processes, like cutting, drilling and thin film ablation with ps pulses.