Inter-chip transmission characteristics of SI on-chip integrated antennas

Inter-chip transmission characteristics of SI on-chip integrated antennas
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DOI：
10.1109/aps.2007.4396045
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发表时间：
2007-06
期刊：
2007 IEEE Antennas and Propagation Society International Symposium
影响因子：
--
通讯作者：
K. Kimoto;N. Sasaki;M. Nitta;T. Kikkawa
K. Kimoto;N. Sasaki;M. Nitta;T. Kikkawa
中科院分区：
其他
文献类型：
--
作者：
K. Kimoto;N. Sasaki;M. Nitta;T. Kikkawa

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研究了采用0.35 μ m CMOS工艺在硅衬底上制作的偶极子天线在3D层叠LSI芯片中进行无线芯片间信号通信时的频域和时域传输特性。传输系数为-48 dB，并确认了用于堆叠芯片间信号传输的幅移键控（ASK）数据传输。
Transmission characteristics of dipole antennas which were fabricated on silicon substrate by 0.35-mum CMOS technology were investigated in the frequency and time domains for wireless inter-chip signal communication in 3D stacked LSI chips. The transmission coefficient was obtained -48 dB and amplitude-shift-keying (ASK) data transmission was confirmed for stacked inter-chip signal transmission.