A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds
A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds
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DOI：
10.1016/j.intermet.2013.04.005
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发表时间：
2013-09-01
期刊：
影响因子：
4.4
通讯作者：
Johnson, C. M.
中科院分区：
文献类型：
--
作者：
Li, J. F.;Agyakwa, P. A.;Johnson, C. M.
本文提出了一种基于固定网格源的数值模拟方法，用于模拟Cu6Sn5和Cu3Sn金属间化合物（IMCs）和其他多层金属间化合物的扩散控制生长。模拟结果可进一步拟合IMCs厚度的实测数据，以确定IMCs的相互扩散系数。与现有的解析方法相比，本文的数值方法不仅精度更高，而且适用于更大范围的实验结果。本文给出了相关方程的详细公式，并利用现有文献和我们自己的实验对Cu6Sn5和Cu3Sn IMCs的实验厚度进行了比较和验证。所得结果为Cu与Sn或Sn基钎料之间形成的Cu6Sn5和Cu3Sn IMCs，或类似金属/金属体系中形成的其他多层IMCs的相互扩散系数提供了新的见解。(C) 2013年作者。Elsevier Ltd.出版。版权所有。
A fixed-grid source-based numerical method has been developed to simulate the diffusion-controlled growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) and other many layers of IMCs. Data fittings of measured thicknesses of the IMCs to the simulated results can be further employed to determine the interdiffusion coefficients for the IMCs. Compared with the existing analytical methods, the present numerical method is not only more accurate, but also applicable to a wider range of experimental results. We report here the detailed formulation of the relevant equations, and compare and validate the present numerical method using experimental thicknesses of Cu6Sn5 and Cu3Sn IMCs from both the existing literature and the experiment of our own. The results obtained provide new insight into the interdiffusion coefficients for the Cu6Sn5 and Cu3Sn IMCs formed between Cu and Sn or Sn-based solders, or other many layers of IMCs formed in similar metal/metal systems. (C) 2013 The Authors. Published by Elsevier Ltd. All rights reserved.