Growth Behavior of Initial Product Layer Formed on Mg Alloy Surface Induced by Polyaniline

Growth Behavior of Initial Product Layer Formed on Mg Alloy Surface Induced by Polyaniline
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DOI:
10.1149/2.1101506jes
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发表时间:
2015-01-01
影响因子:
3.9
通讯作者:
Rohwerder, Michael
Rohwerder, Michael
中科院分区:
工程技术4区
文献类型:
--
作者:
Luo, Yizhong;Wang, Xianhong;Rohwerder, Michael

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据称,聚苯胺(PAN!)诱导的界面保护层的质量对于增强镁合金的腐蚀防护起着至关重要的作用,但其生长行为尚不清楚。这里有一些组合。研究了PANI-翠绿亚胺基(EB)涂层/AZ91D镁合金界面处形成的保护层的结构和生长动力学,以探讨其生长机制。浸泡在0.5 M NaCl溶液中后,EB涂层下生长的界面层表现出较快的钝化速率和增加的耐腐蚀性,这在很大程度上受离子浓度的影响。 XPS 深度分布表明 EB 诱导层是 MgO 和 Mg(OH)(2) 的混合物,其中不存在明显的双层结构,并且 MgO 在整个体膜中占主导地位。这些观察结果表明,EB 和 Mg 之间的相互作用可以通过固体反应促进与 Mg(OH)(2) 混合的稳定的富 MgO 层的更快生长。同时MgO的水化和溶解沉淀反应发生较少,从而导致外层中的Mg(OH)(2)较少。 (C) 作者 2015 年。ECS 出版。这是一篇根据知识共享署名 4.0 许可证(CC BY,http://creativecommons.org/licensestby/4.0/)条款分发的开放获取文章,允许在任何媒体中不受限制地重复使用该作品,前提是正确引用了原始作品。版权所有。
The quality of the interfacial protective layer induced by polyaniline (PAN!) has been claimed to play a crucial role for the enhanced corrosion protection of Mg alloy, but its growth behavior is not well understood. Here some composition. structure and growth kinetics of the protective layer formed at the PANI-emeraldine base (EB) coating/AZ91D Mg alloy interface were investigated to explore the growth mechanism. Upon immersion in 0.5 M NaCl solution, the growing interface layer under EB coating exhibited a fast passivation rate and an increased corrosion resistance, which was largely influenced by ion concentration. XPS depth profiles showed that the EB-induced layer was a mixture of MgO and Mg(OH)(2), in which no significant bi-layer structure existed and MgO was dominant throughout the bulk film. These observations suggest that the interaction between EB and Mg can promote the faster growth of a stable MgO-rich layer mixed with Mg(OH)(2) probably by solid reaction. Meanwhile less hydration of MgO and dissolution-precipitation reaction occur, thus leading to less Mg(OH)(2) in the outer layer. (C) The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licensestby/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. All rights reserved.