Physics-based via model development and verification
Physics-based via model development and verification
复制标题
基于物理的模型开发和验证
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
A. Orlandi
中科院分区：
文献类型：
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作者：
Jianmin Zhang;Q. Chen;Zhiping Yang;J. Drewniak;A. Orlandi
通孔是高速数字系统中关键信号网络中最受关注的问题之一，因此被广泛建模和研究。3-D全波建模可以通过正确的模型设置准确地预测过孔的电气性能，这与对信号过渡和与过孔相关联的波传播背后的物理的理解有关。本文将详细介绍基于物理的通孔模型开发，方法是跟踪电流路径并将通孔结构映射到电路元件/块，其中使用剥离和分区方法将整个通孔结构分解为通孔块。作为一个例子，一个简单的过孔结构的信号从微带线到微带线的过渡进行了研究。基于物理的仿真和全波建模在频域中与S参数以及在时域中与不同数据速率下的眼高和眼宽之间取得了良好的一致性。
Vias are widely modeled and investigated as they are one of the most concerns for the critical signal nets in high-speed digital systems. 3-D full-wave modelling can predict the electrical performance of a via accurately with correct model settings, which are related to the understood of the physics behind the signal transition and the wave propagation associated with the via. This paper will detail physics-based via model development by tracking the current path and mapping the via structures to circuit components/blocks where the peeling and partitioning method is used to decompose the entire via structure into via blocks. A simple via structure with the signal transitions from a microstrip to a microstrip is studied as an example. Good agreement has been achieved between the physics-based via simulation and the full-wave modeling in the frequency-domain with S-parameters and in the time-domain with eye-height and eye-width at different data rates.