Fatigue Damage of Copper with Ultra-Fine Structure Due to ECAP

Fatigue Damage of Copper with Ultra-Fine Structure Due to ECAP
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超细结构铜的ECAP疲劳损伤

DOI:
10.2472/jsms.53.1117
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发表时间:
2004
期刊:
Journal of The Society of Materials Science, Japan
影响因子:
--
通讯作者:
Takaei Yamamoto
Takaei Yamamoto
中科院分区:
--
文献类型:
--
作者:
M. Goto;S. Ham;C. Lim;T. Yakushiji;Tetsushi Morita;Takaei Yamamoto

文献摘要

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虽然对等径角挤压形成超细晶粒金属的微观组织研究较多,但对等径角挤压形成超细晶粒金属的疲劳特性研究较少。在本研究中,使用了纯度为99.99%的无氧铜。在ECAP工艺之前,材料在500℃下正火1小时。每个ECAP周期后采用Bc路线旋转90°。为了获得晶粒尺寸为300nm的超细晶粒,采用Bc路线共进行了4道次的ECA压制。对光滑试件进行了旋转弯曲疲劳试验。为了阐明eced铜的疲劳机理,对eced铜的表面损伤进行了直接观察和复制观察。用光学显微镜和扫描电镜观察了表面形貌的变化。采用透射电镜对其微观结构进行观察。综合各显微观察的实验结果,讨论了超细晶粒铜的疲劳损伤。
Although there are many studies on the microstructure of various metals with ultra-fine grain formed by ECAP (equal channel angular pressing), a few studies have investigated the fatigue characteristics of ECAPed metals. In the present study, 99.99% pure, oxygen-free copper was used. Before the ECAP process, the material was normalized at 500°C for 1 hour. A Bc route with 90° rotation after each ECAP cycle was utilized. To obtain the ultra-fine grain with 300nm grain size, a total of 4 passes of ECA pressing with Bc route were performed. Rotating bending fatigue tests of smooth specimens were carried out. Successive observations on the surface damage due to both the direct and the replica observation were carried out to clarify the fatigue mechanism of ECAPed copper. An optical microscope and a scanning electron microscope were used for the observation of the change in surface morphology. A transmission electron microscope was used for observation of microstructure. Putting the experimental results from the observation of each microscope together, fatigue damage of copper with ultra-fine grain was discussed.