Fatigue Damage of Copper with Ultra-Fine Structure Due to ECAP
Fatigue Damage of Copper with Ultra-Fine Structure Due to ECAP
复制标题
超细结构铜的ECAP疲劳损伤
DOI:
10.2472/jsms.53.1117
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发表时间:
2004
期刊:
影响因子:
--
通讯作者:
Takaei Yamamoto
中科院分区:
文献类型:
--
作者:
M. Goto;S. Ham;C. Lim;T. Yakushiji;Tetsushi Morita;Takaei Yamamoto
Although there are many studies on the microstructure of various metals with ultra-fine grain formed by ECAP (equal channel angular pressing), a few studies have investigated the fatigue characteristics of ECAPed metals. In the present study, 99.99% pure, oxygen-free copper was used. Before the ECAP process, the material was normalized at 500°C for 1 hour. A Bc route with 90° rotation after each ECAP cycle was utilized. To obtain the ultra-fine grain with 300nm grain size, a total of 4 passes of ECA pressing with Bc route were performed. Rotating bending fatigue tests of smooth specimens were carried out. Successive observations on the surface damage due to both the direct and the replica observation were carried out to clarify the fatigue mechanism of ECAPed copper. An optical microscope and a scanning electron microscope were used for the observation of the change in surface morphology. A transmission electron microscope was used for observation of microstructure. Putting the experimental results from the observation of each microscope together, fatigue damage of copper with ultra-fine grain was discussed.