Selective Electroless Nickel Plating on Polyelectrolyte Multilayer Platforms
Selective Electroless Nickel Plating on Polyelectrolyte Multilayer Platforms
复制标题
DOI:
10.1021/la010755z
复制
发表时间:
2001-09
期刊:
影响因子:
3.9
通讯作者:
T. Wang;B. Chen;‡. A. M. F. Rubner;R. Cohen
中科院分区:
文献类型:
--
作者:
T. Wang;B. Chen;‡. A. M. F. Rubner;R. Cohen
Polyelectrolyte multilayers (PEMs) fabricated by the layer-by-layer adsorption of poly(acrylic acid) (PAA) and poly(allylamine hydrochloride) (PAH) are used to selectively bind palladium catalysts for electroless nickel plating. Depending on the pH conditions used during multilayer processing and the polyelectrolyte adsorbed last, the surface of the PAH/PAA-based multilayers can be tuned to contain primarily PAA, primarily PAH, or a mixture of PAA and PAH functionalities (i.e., carboxylic acids or amines). The palladium-complex ions of tetraaminepalladium chloride (Pd(NH3)4Cl2) or sodium tetrachloropalladate (Na2PdCl4) bind selectively by ion exchange only to surfaces of PAA or PAH, respectively. Substrates that are coated with regions of PAA-topped and PAH-topped multilayers, fabricated at a PAH pH of 7.5 and a PAA pH of 3.5, bind [Pd(NH3)4]2+ only on the PAA regions. Upon immersion into an electroless nickel plating bath, only the PAA-topped regions of the substrate, activated by the Pd complex, promote...