Study on the Influence of PCB Parameters on the Shielding Effectiveness of Metal Cavity With Holes
Study on the Influence of PCB Parameters on the Shielding Effectiveness of Metal Cavity With Holes
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DOI：
10.1109/itnec.2019.8729288
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发表时间：
2019-03
期刊：
影响因子：
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通讯作者：
Fulin Li;Ji-hong Han;Chang Zhang
中科院分区：
文献类型：
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作者：
Fulin Li;Ji-hong Han;Chang Zhang
为了满足数据处理、信息通信等需要，许多现代电子设备内部都配备有PCB，这对带孔金属腔体的屏蔽效能产生了影响。基于延长传输线法，将PCB等效为一块相同厚度的介质板，并推导了屏蔽效能的计算公式。比较有或没有 PCB 时空腔的屏蔽效能。分析了PCB的厚度、安装位置、介电常数、电导率等因素对屏蔽效能的影响。通过与电磁仿真软件CST的仿真结果对比，验证了所建立模型的有效性。研究成果可为电磁脉冲效应分析和电子设备电磁安全防护设计提供参考。
In order to meet the needs of data processing, information communication, etc., many modern electronic devices are equipped with PCBs inside, which has an impact on the shielding effectiveness of the metal cavity with holes. Based on the extended transmission line method, the PCB is equivalent to a dielectric slab of the same thickness and the calculation formula of the shielding effectiveness is deduced. The shielding effectiveness of the cavity is compared in the presence or absence of the PCB. The influence on shielding effectiveness of the thickness, mounting position, permittivity, conductivity and other factors of the PCB are analyzed. The effectiveness of the established model is verified by comparing the simulation results with the electromagnetic simulation software CST. The research results can provide reference for electromagnetic pulse effect analysis and electromagnetic safety protection design of electronic devices.