Fine-line structuring of microwave components on LTCC substrates
Fine-line structuring of microwave components on LTCC substrates
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LTCC 基板上微波元件的细线结构
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
J. Muller
中科院分区：
文献类型：
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作者：
D. Stopel;K.;S. Humbla;M. Mach;T. Mache;A. Rebs;G. Reppe;G. Vogt;M. Hein;J. Muller
低温共烧陶瓷（LTCC）广泛应用于射频和微波领域。陶瓷多层技术提供了一个真正的三维电路技术，气密密封，混合集成，并在适度的成本良好的微波性能。为了利用毫米级引导波长的高频，线和空间的精度优于标准图案化方法可用的50 µm分辨率是至关重要的。
Low Temperature Co-fired Ceramics (LTCC) are used in a wide range of RF and microwave applications. The ceramic multilayer technology provides a truly three-dimensional circuit technology, hermetical sealing, hybrid integration, and favorable microwave properties at moderate costs. In order to take advantage of high frequencies with guided wavelengths of the order of millimeters, a precision of lines and spaces better than the resolution of 50 µm available with standard patterning methods is crucial.