Microwave photonics: Opportunities for photonic integration

Microwave photonics: Opportunities for photonic integration
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发表时间：
2008-12
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通讯作者：
A. Seeds;F. Pozzi;C. Renaud;M. Fice;L. Ponnampalam;D. Rogers;I. Lealman;R. Gwilliam
A. Seeds;F. Pozzi;C. Renaud;M. Fice;L. Ponnampalam;D. Rogers;I. Lealman;R. Gwilliam
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作者：
A. Seeds;F. Pozzi;C. Renaud;M. Fice;L. Ponnampalam;D. Rogers;I. Lealman;R. Gwilliam

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本文综述了微波光子系统集成的前景和技术。利用光子太赫兹产生的先进应用，说明了光子集成的潜在价值。介绍了基于量子阱混合、磷化铟单片集成和硅主板混合集成的集成技术。最后，对集成技术的应用前景进行了展望。
This paper reviews the prospects and technologies for integration in microwave photonic systems. An advanced application photonic THz generation is used to illustrate the potential value of photonic integration. Integration technologies for this system based on quantum well intermixing, monolithic integration on indium phosphide and hybrid integration using silicon motherboard technology are described. Finally, some pointers to future applications of integration are given.