Measurement of mechanical properties for MEMS materials
Measurement of mechanical properties for MEMS materials
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DOI：
10.1088/0957-0233/10/8/305
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发表时间：
1999-08
影响因子：
2.4
通讯作者：
Taechung Yi;C. Kim
中科院分区：
文献类型：
--
作者：
Taechung Yi;C. Kim
微机电系统（MEMS）中的微观机械器件使用诸如硅和许多其他薄膜的材料，这些材料以前未被认为是机械材料，因此没有很好地表征它们的机械性能。然而，随着该领域的成熟，未来几年的持续研究和商业开发将需要更好地了解机械性能，如杨氏模量和断裂强度。单轴拉伸试验通常被认为是测量机械性能的最可靠的方法。然而，与MEMS测试样品的微观尺寸相关联的问题，例如样品处理和样品对准，导致了MEMS开始时的膜膨胀测试和固有频率测试等替代方法。本文综述了近年来微尺度力学性能测试方法及其结果。许多报告，基于两种不同类型的测试，梁弯曲和直接拉伸，介绍。还解释了在微观尺度上集成样品和加载系统的努力。本文讨论了微尺度力学性能测试的最新进展--疲劳研究。列出所述测试方法的结果以供比较。
The microscopic mechanical devices in microelectromechanical systems (MEMS) use materials such as silicon and many other thin films, which had not previously been considered mechanical materials and thus are not well characterized regarding their mechanical properties. However, as the field matures, sustained research and commercial development in the coming years will demand better understanding of mechanical properties such as Young's modulus and the fracture strength. Uniaxial tension testing is generally considered the most reliable way to measure the mechanical properties. However, the problems associated with the microscopic size of the test specimen for MEMS, such as sample handling and sample alignment, led to such alternative ways as membrane-bulge testing and natural frequency testing at the beginning of MEMS. In this paper, recent methods for testing microscale mechanical properties and their results are summarized. Many reports, based on two distinct types of test, beam bending and direct tension, are introduced. The efforts to integrate the sample and loading system on the microscopic scale are also explained. Studies of fatigue, the most recent development in microscale measurement of mechanical properties, are discussed. The results from the testing methods described are listed for comparison.