Applications of Automated High Resolution Strain Mapping in TEM on the Study of Strain Distribution in MOSFETs
Applications of Automated High Resolution Strain Mapping in TEM on the Study of Strain Distribution in MOSFETs
复制标题
TEM 中自动高分辨率应变映射在 MOSFET 应变分布研究中的应用
DOI:
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发表时间:
2014
期刊:
影响因子:
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通讯作者:
J. K. Weiss
中科院分区:
文献类型:
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作者:
A. Darbal;Raman D. Narayan;C. Vartuli;T. Aoki;J. Mardinly;S. Nicolopoulos;J. K. Weiss
Engineered strain in the channel is a cost effective means of improving the performance of devices [1]. Through deliberately introducing strain in silicon, the band gap is altered, which in turn can be used to enhance the electron mobility. A metrology tool for reliable channel strain determination is crucial for process development. Given the scale of modern semiconductor devices, electron diffraction in the transmission electron microscope (TEM) is well suited for this purpose. In particular, nanobeam diffraction (NBD) is interesting as it is possible to acquire NBD patterns at high spatial resolution and is relatively easy to set up in most modern TEMs [2]. However, the presence of strong dynamical effects in conventional NBD patterns makes it difficult to obtain reliable strain data as the spot intensity distributions are strongly dependent on local specimen thickness and orientation. This is overcome by precessing the beam as the diffraction patterns are acquired [3]. With precession the incident beam is tilted and rotated (typically at 100 Hz) about the optic axis so that the dynamical effects are averaged out and the diffraction patterns are acquired under quasi-kinematical conditions. In addition, precession electron diffraction (PED) patterns have better sampling of higher order reflections, which are more sensitive to small changes in lattice parameters.