$W$ -Band Bandpass Filter Using Micromachined Air-Cavity Resonator With Current Probes
$W$ -Band Bandpass Filter Using Micromachined Air-Cavity Resonator With Current Probes
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DOI：
10.1109/lmwc.2010.2042552
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发表时间：
2010-03
影响因子：
3
通讯作者：
Sang-Sub Song;C. Yoo;K. Seo
中科院分区：
文献类型：
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作者：
Sang-Sub Song;C. Yoo;K. Seo
这封信介绍了一种 W 波段微机械气腔带通滤波器 (BPF)，该滤波器采用了微机械硅气腔谐振器与硅柱的新颖集成方法。利用与深反应离子蚀刻工艺同时制造的硅柱以形成空腔结构，微机械加工的硅气腔可以通过倒装芯片互连轻松集成在封装基板上。在这项工作中，采用具有倒装芯片互连的薄膜基板作为封装基板，其中硅柱用作气腔谐振器和TFMS输入/输出馈线之间的电流探针。通过新颖的气腔谐振器集成，在具有倒装芯片互连的薄膜基板上成功演示了W波段四极BPF，其最小插入损耗为1.3 dB，回波损耗优于16 dB，中心频率为93.7 GHz时具有4.9%的3 dB分数带宽。
This letter presents a W -band micromachined air-cavity bandpass filter (BPF) using a novel integration method of a micromachined silicon air-cavity resonator with silicon pillars. With silicon pillars, which were fabricated simultaneously with a deep reactive ion etching process for forming a cavity structure, a micromachined silicon air-cavity can be easily integrated on a package substrate with a flip-chip interconnection. In this work, a thin-film substrate with a flip-chip interconnection was employed as a package substrate, in which the silicon pillars were used as the current probe between the air-cavity resonator and TFMS input/output feeding lines. With the novel integration of the air-cavity resonator, a W-band four-pole BPF has been successfully demonstrated on a thin-film substrate with a flip-chip interconnection, which exhibits a minimum insertion loss of 1.3 dB and return loss better than 16 dB with a 4.9% 3-dB fractional bandwidth at a center frequency of 93.7 GHz.