Applications of multi-walled carbon nanotube in electronic packaging.
Applications of multi-walled carbon nanotube in electronic packaging.
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DOI：
10.1186/1556-276x-7-183
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发表时间：
2012-03-09
影响因子：
--
通讯作者：
Jing H
中科院分区：
文献类型：
--
作者：
Tan CM;Baudot C;Han Y;Jing H
集成电路芯片的热管理是当今面临的一个日益重要的挑战。芯片的散热一般通过贴片材料和焊料来实现。随着这些材料的温度梯度，它们会产生很高的热机械应力，因此它们也必须具有机械强度，以便为芯片提供良好的机械支撑。本文论证了多壁碳纳米管的应用可以提高环氧树脂和无铅焊料的热导率和机械强度。
Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.