Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
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DOI：
10.2320/matertrans.mra2008269
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发表时间：
2008-12-01
影响因子：
1.2
通讯作者：
Hirose, Akio
中科院分区：
文献类型：
--
作者：
Morita, Toshiaki;Yasuda, Yusuke;Hirose, Akio
我们研究了一种新的键合利用微米级氧化银（Ag 2 O）颗粒。我们的研究结果表明，用于半导体模块的电极之间的键合可以通过将肉豆蔻醇添加到氧化银颗粒中，然后在2.5MPa的压力下将混合物在空气中加热300 ℃来实现。由于该接合技术在醇的存在下还原银氧化物时产生几纳米尺寸的银颗粒，因此可以实现低温烧结和接合。[doi：10.2320/matertrans.MRA2008269]
We investigated a new bonding utilizing micro-scaled silver-oxide (Ag2O) particles. The results of our investigations revealed that bonding between electrodes using for semiconductor modules can be accomplished by adding myristyl alcohol to silver-oxide particles, followed by heating the mixture in air 300 degrees C under a pressure of 2.5 MPa. Since this bonding technique produces silver particles with a size of a few nanometers when the silver oxide is reduced by the presence of the alcohol, low-temparature sintering and bonding can be achieved. [doi: 10.2320/matertrans.MRA2008269]