Fabrication of plastic microchips by hot embossing
Fabrication of plastic microchips by hot embossing
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DOI：
10.1039/b109775j
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发表时间：
2002-01-01
期刊：
影响因子：
6.1
通讯作者：
Becker, H
中科院分区：
文献类型：
--
作者：
Kricka, LJ;Fortina, P;Becker, H
具有不同设计的微通道（100微米宽，40微米深）的塑料微芯片已经在聚甲基丙烯酸甲酯中通过热压工艺使用从硅片母片开始生产的电铸工具制造。热压晶片用专有的溶剂粘接工艺覆盖聚甲基丙烯酸甲酯顶部。在芯片的顶部钻了一些孔，以便进入通道。这些芯片用液体进行了测试，结果显示很容易填满。芯片顶部与热压底座之间的密封是有效的，当流体通过微通道泵送时，通道没有泄漏。这些芯片还用精液样本进行了测试，塑料芯片的性能与之前的硅玻璃芯片和玻璃芯片相同。这种微加工技术为制造用于分析应用的透明微芯片提供了一种可行的、潜在的大批量低成本生产方法。
Plastic microchips with microchannels (100 mum wide, 40 mum deep) of varying designs have been fabricated in polymethylmethacrylate by a hot embossing process using an electroform tool produced starting with silicon chip masters. Hot-embossed chips were capped with a polymethylmethacrylate top using a proprietary solvent bonding process. Holes were drilled through the top of the chip to allow access to the channels. The chips were tested with fluid and shown to fill easily. The seal between the top of the chip and the hot embossed base was effective, and there was no leakage from the channels when fluid was pumped through the microchannels. The chips were also tested with a semen sample and the plastic chip performed identically to the previous silicon-glass and glass versions of the chip. This microfabrication technique offers a viable and potentially high-volume low cost production method for fabricating transparent microchips for analytical applications.