Surface X-ray diffraction study of Cu UPD on Au(111) electrode in 0.5 M H2SO4 solution:: the coadsorption structure of UPD copper, hydration water molecule and bisulfate anion on Au(111)

Surface X-ray diffraction study of Cu UPD on Au(111) electrode in 0.5 M H2SO4 solution:: the coadsorption structure of UPD copper, hydration water molecule and bisulfate anion on Au(111)
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DOI:
10.1016/s0039-6028(02)01634-5
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发表时间:
2002-08-10
期刊:
影响因子:
1.9
通讯作者:
Yoda, Y
Yoda, Y
中科院分区:
化学3区
文献类型:
--
作者:
Nakamura, M;Endo, O;Yoda, Y

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用原位表面X射线衍射法测定了0.5M H_2SO_4溶液中Au(111)表面欠电位沉积(UPD)铜、水合水分子和硫酸氢根离子的结构。在Au(111)电极上,硫酸根离子与UPD铜在250-400 mV之间形成了root3xroot3R30°结构。在该电势范围内,铜、硫酸氢根离子和水合水分子共吸附在Au(111)表面,铜和硫酸氢根离子的覆盖度分别为0.6667和0.3333。共吸附结构由P31m的Laue对称性表示。在每个铜原子的顶部,一个水合水分子被调节,形成一个稳定的、最紧密堆积的密度很大的水附着层。在比940 mV更正的电位下,硫酸氢根离子在裸露的Au(111)表面形成了root3xroot7结构。(C)2002 Elsevier Science B.V.保留所有权利。
The structure of underpotential deposition (UPD) copper, a hydration water molecule, and a bisulfate anion on Au(111) surface in 0.5 M H2SO4 solution has been determined by in situ surface X-ray diffraction study. The bisulfate anion and the UPD copper form a root3 x root3R30degrees structure on an Au(111) electrode at a potential between 250 and 400 mV. At this potential range, UPD Cu, a bisulfate anion, and a hydration water molecule coadsorb on Au(111), while the coverages of copper and bisulfate anion are 0.6667 and 0.3333, respectively. The coadsorption structure is represented by Laue symmetry of P31m. On top of each copper atom, a hydration water molecule is accommodated to form a stable and closest-packed water adlayer with a large density. At a more positive potential than 940 mV, the bisulfate anion forms a root3 x root7 structure on a bare Au(111) surface. (C) 2002 Elsevier Science B.V. All rights reserved.