High-temperature strain field measurement using digital image correlation

High-temperature strain field measurement using digital image correlation
复制标题

DOI:
10.1243/03093247jsa478
复制
发表时间:
2009-05-01
影响因子:
1.6
通讯作者:
Preuss, M.
Preuss, M.
中科院分区:
工程技术4区
文献类型:
--
作者:
Grant, B. M. B.;Stone, H. J.;Preuss, M.

文献摘要

被引文献

相似文献

提出了一种不使用表面标记或斑点的方法,利用数字图像相关(DIC)获得适合于应变测量的高温下样品表面的良好图像。这是通过使用滤光片和蓝色照明来抑制黑体辐射来实现的。仅使用相对较低的照明水平,该方法被证明能够提供精确的DIC测量高达1100摄氏度,并确定了监测菌株到1400摄氏度的潜力。通过测量镍基高温合金在室温至1000℃范围内的杨氏模量和热膨胀系数,证明了该方法的有效性;这两个参数在文献中已经很好地建立,并且需要高应变灵敏度才能可靠地测定。
A method is presented for obtaining good images of sample surfaces at high temperatures, suitable for strain measurement, by digital image correlation (DIC) without the use of surface markers or speckles. This is accomplished by suppressing black-body radiation through the use of filters and blue illumination. Using only relatively low levels of illumination the method is demonstrated to be capable of providing accurate DIC measurements up to 1100 degrees C, and the potential to monitor strains to 1400 degrees C is identified. The capability of the method is demonstrated by measuring the Young's modulus and coefficient of thermal expansion of a nickel-base superalloy at temperatures from ambient to 1000 degrees C; two parameters that are well established in the literature and that require high strain sensitivity for their reliable determination.