Diversity and feasibility of direct bonding: a survey of a dedicated optical technology.
Diversity and feasibility of direct bonding: a survey of a dedicated optical technology.
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直接键合的多样性和可行性：专用光学技术的调查。
DOI：
10.1364/ao.33.001154
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发表时间：
1994
期刊：
影响因子：
1.9
通讯作者：
A. Gorkum
中科院分区：
文献类型：
--
作者：
J. Haisma;B. A. Spierings;U. Biermann;A. Gorkum
本文的目的是回顾飞利浦研究院近十年来的直接键合活动，包括直接键合的多样性和可行性。材料的粘接性由其几何形状和机械、物理和化学表面状态决定。物理直接结合提供真空密封结合，其是无接缝和无胶的，并且其允许待结合的界面的工程化。层可以被掩埋，并且可以在光学元件之间创建反射无损键合。研究了各种材料：（难熔）金属、半金属、硼、金刚石、碳化物、氟化物、氮化物、氧化物和硫属化物。我们所描述的应用涉及到界面工程，波导，和纤维板的直接粘接。
The aim of this paper is to review almost a decade of direct-bonding activities at Philips Research including the diversity and feasibility of direct bonding. The bondability of a material is determined by its geometrical shape and mechanical, physical, and chemical surface states. Physically direct bonding provides a vacuumtight bond, which is jointless and glueless, and it permits engineering of the interfaces to be bonded. Layers can be buried, and reflective-lossless bonds between optical elements can be created. A variety of materials are investigated: (refractory) metals, a semimetal, boron, diamond, a carbide, fluorides, nitrides, oxides, and a chalcogenide. The applications that we describe relate to interface engineering, waveguiding, and the direct bonding of a fiber plate.