Effect of holding temperature on microstructures and Jc properties of YBa2Cu3O7-X films fabricated by TFA-MOD method
Effect of holding temperature on microstructures and Jc properties of YBa2Cu3O7-X films fabricated by TFA-MOD method
复制标题
DOI：
10.1016/j.physc.2013.04.067
复制
发表时间：
2013-11-01
影响因子：
1.7
通讯作者：
Izumi, T.
中科院分区：
文献类型：
--
作者：
Konya, K.;Ootaguro, K.;Izumi, T.
通过引入晶化过程中的保温温度，研究了具有BaZrO 3（BZO）钉扎中心的YBa 2Cu 3 O 7-X（YBCO）薄膜的微结构与临界电流密度（Jc）之间的相关性。结果表明，在有保温温度的YBCO薄膜中，BZO颗粒尺寸减小，而Jc增大。结果表明，通过实施附加工艺、保温温度和引入更小的BZO颗粒作为人工钉扎中心，成功地制备了具有改善微结构的薄膜，并获得了高的内场Jc。(C)2013年爱思唯尔B。版权所有© 2016
In this study, we investigated the correlation between microstructures and critical current density (Jc) of YBa2Cu3O7-X (YBCO) films with BaZrO3 (BZO) pinning centers by introducing holding temperature during the crystallization process. Smaller BZO particles and higher in-field Jc were found in the YBCO film with holding temperature than the one without. As a result, films with improved microstructures were successfully fabricated by implementation of additional process, holding temperature, and highly in-field Jc were obtained by introducing smaller BZO particles as artificial pinning centers. (C) 2013 Elsevier B. V. All rights reserved.