Hybrid Additive Manufacturing Method for Selective Plating of Freeform Circuitry on 3D Printed Plastic Structure
Hybrid Additive Manufacturing Method for Selective Plating of Freeform Circuitry on 3D Printed Plastic Structure
复制标题
用于在 3D 打印塑料结构上选择性电镀自由曲面的混合增材制造方法
DOI：
10.1002/admt.201800529
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发表时间：
2019-02-01
影响因子：
6.8
通讯作者：
He, Jiangling
中科院分区：
文献类型：
--
作者：
Li, Ji;Wang, Yang;He, Jiangling
这项工作提出了一种混合增材制造方法，结合了双材料熔融沉积成型（FDM）3D打印和选择性化学镀的优点。该方法依赖于双材料FDM 3D打印结构的选择性敏化/活化和金属化。高导电镍合金只能沉积在可镀塑料表面上，使不可镀塑料裸露。研究表明，丙烯腈-丁二烯-苯乙烯和聚对苯二甲酸乙二醇酯二醇改性材料的组合提供了最佳的金属化选择性和膜粘附强度。系统研究了化学镀温度、pH值、时间等工艺参数对金属膜导电性能的影响。通过四探针测量、能谱分析和扫描电镜截面分析发现，金属沉积速率主要取决于施镀温度，而镀层成分主要取决于pH值。因此，金属薄膜的导电性可以根据实际应用的具体要求定制。当在50 ℃和pH 9下进行化学镀时，获得6.7 × 10（-5）Ω cm的最小电阻率。一个发光二极管（LED）闪烁电路制作在两个2D和3D的方式作为演示，以证明该技术在工业应用中的可行性和潜力。
This work proposes a hybrid additive manufacturing method coupling the advantages of dual-material fused deposition modeling (FDM) 3D printing and selective electroless plating. The method relies on the selective sensitization/activation and metallization of dual-material FDM 3D printed structure. High-conductive nickel alloy can only be deposited on the platable plastic surface leaving the nonplatable plastic bare. The study reveals that a combination of acrylonitrile-butadiene-styrene and polyethylene terephthalate glycol-modified materials provides the best metallization selectivity and film adhesion strength. The effects of electroless plating parameters such as temperature, pH value, and duration on the electrical conductivity of metallic film are systematically investigated. Through four-point probe measurement, energy-dispersive X-ray spectroscopy inspection, and scanning electron microscopy cross-section analysis, it is found that the metal deposition rate majorly depends on the plating temperature, while the composition of plated film is mainly determined by the pH value. Thus, the conductivity of metallic film can be customized according to the detailed requirements of practical applications. A minimal resistivity of 6.7 x 10(-5) Omega cm is obtained when electrolessly plated at 50 degrees C and pH 9. A light-emitting diode (LED) blinking circuitry is fabricated in both 2D and 3D manners as demonstrators to prove the feasibility and potential of this technology in industry applications.