Experimentally-validated mesoscale modeling of the coupled mechanical-thermal response of AP-HTPB energetic material under dynamic loading
Experimentally-validated mesoscale modeling of the coupled mechanical-thermal response of AP-HTPB energetic material under dynamic loading
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DOI：
10.1007/s10704-016-0141-7
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发表时间：
2017-01-01
影响因子：
2.5
通讯作者：
Oskay, Caglar
中科院分区：
文献类型：
--
作者：
Hu, Ruize;Prakash, Chandra;Oskay, Caglar
本文采用计算-实验相结合的方法研究了端羟基聚丁二烯（HTPB）/高氯酸铵（AP）复合含能材料在动态载荷作用下的细观热力学行为。计算模型考虑了AP-HTPB界面脱粘、脱粘后界面摩擦和粘弹性耗散引起的温升以及耗散界面过程。该接口建模使用结合接触算法的内聚区模型，以考虑界面分离，颗粒/粘合剂接触和热生成。HTPB粘结剂被建模为绝热温升的粘弹性。三个实验进行校准和验证模型。采用拉曼光谱和压痕实验确定界面特性，采用Kolsky杆拉伸实验沿着于同步辐射X射线衍射原位测量来验证模型，并了解动态载荷下的界面分离特性。
This manuscript presents a combined computational-experimental study of the mesoscale thermo-mechanical behavior of the Hydroxyl-terminated polybutadiene (HTPB) bonded ammonium perchlorate (AP) composite energetic material subjected to dynamic loading conditions. The computational model considers the AP-HTPB interface debonding, post-debonding interface friction and temperature rise due to viscoelastic dissipation as well as dissipative interfacial processes. The interface is modeled using a cohesive zone model combined with a contact algorithm to account for the interface separation, particle/binder contact and heat generation. The HTPB binder is modeled as viscoelastic with adiabatic temperature rise. Three experiments are conducted to calibrate and validate the model. Raman spectroscopy and indentation experiment are employed to determine the interface properties, whereas Kolsky bar tension test along with in-situ synchrotron X-ray diffraction measurements are used to validate the model and understand the interface separation characteristics under dynamic loading.