The Use of High Speed Selective Jet Electrodeposition of Gold for the Plating of Connectors
The Use of High Speed Selective Jet Electrodeposition of Gold for the Plating of Connectors
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DOI：
10.1080/00202967.1994.11871019
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发表时间：
1994
影响因子：
1.9
通讯作者：
C. Bocking;B. Cameron
中科院分区：
文献类型：
--
作者：
C. Bocking;B. Cameron
高速选择性喷射电沉积（HSSJE）是一种可以在非常高的沉积速率下选择性地产生电沉积物而不需要掩蔽的工艺。Bocking以前的论文已经描述了这个过程的原理。本文介绍了一种市售的硬金电解质的适应过程。在喷射条件下，沉积速率可达2.5 μm/s。在高速喷射条件下产生的沉积物的性质已被定义，并与常规生产的相同类型的沉积物进行比较。基于HSSJE原理的原型卷对卷电镀单元已经建立，由于喷嘴单元和喷射清洁过程的紧凑性，其是更传统的卷对卷电镀单元的尺寸的一小部分。虽然长期试验的结果尚未公布，但提供了镀有该单元的连接器性能的一些初步结果。
SUMMARYHigh speed selective jet electrodeposition (HSSJE) is a process by which electrodeposits can be produced at very high deposition rates, selectively, without the need for masking. Previous papers by Bocking have described the principles of the process. This paper describes the adaptation of a commercially available hard gold electrolyte to the process. Deposition rates of up to 2.5 μm/second were found to be possible under jetting conditions. The properties of the deposits produced under high speed jet conditions have been defined and compared to conventionally produced deposits of the same type. A prototype reel-to reel plating unit based on the principles of HSSJE has been built which, due to the compactness of the nozzle unit and jet cleaning process, is a fraction of the size of more conventional reel-to-reel plating units. Whilst the results of long term trials are not yet available, some initial results of the performance of connectors plated with this unit are presented.