Improving the Cooling Efficiency of Heat Sinks through the Use of Different Types of Phase Change Materials
Improving the Cooling Efficiency of Heat Sinks through the Use of Different Types of Phase Change Materials
复制标题
通过使用不同类型的相变材料提高散热器的冷却效率
DOI：
10.3390/technologies6010005
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
I. Assi
中科院分区：
文献类型：
--
作者：
Ibrahim Mjallal;Hussien Farhat;M. Hammoud;Samer Ali;I. Assi
随着电子设备温度的升高，其故障率也会增加。这就是为什么电气设备应该冷却。相变材料（Phase Change Materials，PCM）是一种很有前途的制冷技术。一种新的被动温度管理技术，涉及到直接放置在芯片上的PCM，已被探索和发展。相变材料是一种潜在的温度调节器，可以储存热能，并分别在融化和冻结过程中释放热能。基于PCM的散热器可以有效地存储从电子部件散发的热量，以尽可能地延迟电子设备的峰值温度，然后在关闭期间释放存储的能量。本文比较了在不同热流密度下，有无相变材料的散热器上的温度分布。此外，两种不同的PCM具有不同的密度，即盐水合物和蜡，已被研究在冷却电子设备。
As the temperature of electronic devices increases, their failure rate increases. That is why electrical devices should be cooled. One of the promising cooling techniques is using Phase Change Materials (PCMs). A new passive temperature management technique, that involves the direct placement of PCMs on the chip, has been explored and developed. PCMs are potential temperature regulators that can store thermal energy and release it during melting and freezing respectively. PCM-based heat sinks can efficiently store the heat dissipated from the electronic components to delay the peak temperature of the electronic devices as much as possible and then release the stored energy during the off period. This paper compares the temperature distribution on a heat sink with and without PCM with different magnitudes of heat flux. Also, two different PCMs with different densities, namely salt-hydrate and wax, have been investigated in cooling electronic devices.