Microstructural change and hardness of lead free solder alloys
Microstructural change and hardness of lead free solder alloys
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无铅焊料合金的微观结构变化和硬度
DOI：
10.1109/ecodim.1999.747686
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
T. Ariga
中科院分区：
文献类型：
--
作者：
Y. Miyazawa;T. Ariga
两种类型的无铅焊料，即 Sn-Ag 共晶合金和 Sn-Zn 共晶合金，作为 Sn-Pb 共晶焊料和 Sn-Pb 共晶合金的潜在替代品，被发现在室温（25 C，298 K，77 F）和高温（100 C，373 K 212 F）储存期间会老化软化。另一种无铅焊料——Sn-Bi共晶合金的硬度在室温和高温储存期间没有变化。然而，Sn-Bi共晶合金在室温和高温储存过程中显微组织异常粗化。
Two types of Pb free solder, Sn-Ag eutectic alloy and Sn-Zn eutectic alloy, as potential replacements for Sn-Pb eutectic solder and Sn-Pb eutectic alloy were found to age-soften during storage at room temperature (25 C, 298 K, 77 F) and high temperature (100 C, 373 K 212 F). The hardness of another type of Pb free solder, Sn-Bi eutectic alloy, did not change during storage at room and high temperature. However, the microstructure of Sn-Bi eutectic alloy coarsened unusually during storage at room and high temperature.