Centip3De: A 64-Core, 3D Stacked Near-Threshold System
Centip3De: A 64-Core, 3D Stacked Near-Threshold System
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DOI：
10.1109/mm.2013.4
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发表时间：
2012-08
期刊：
影响因子：
3.6
通讯作者：
R. Dreslinski;D. Fick;Bharan Giridhar;Gyouho Kim;Sangwon Seo;Matthew R. Fojtik;Sudhir K. Satpathy;Yoonmyung Lee;Daeyeon Kim;Nurrachman Liu;M. Wieckowski;Gregory K. Chen;D. Sylvester;D. Blaauw;T. Mudge
中科院分区：
文献类型：
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作者：
R. Dreslinski;D. Fick;Bharan Giridhar;Gyouho Kim;Sangwon Seo;Matthew R. Fojtik;Sudhir K. Satpathy;Yoonmyung Lee;Daeyeon Kim;Nurrachman Liu;M. Wieckowski;Gregory K. Chen;D. Sylvester;D. Blaauw;T. Mudge
Centip 3De使用3D集成和近阈值计算之间的协同作用来创建可重新配置的系统，该系统提供节能操作和解决单线程性能瓶颈的技术。最初的Centip 3De设计是一个七层3D堆叠设计，具有128个内核和256 Mbytes的DRAM。硅的结果显示了130 nm技术的两层64核系统，实现了3，930 DMIPS/W的能效。
Centip3De uses the synergy between 3D integration and near-threshold computing to create a reconfigurable system that provides both energy-efficient operation and techniques to address single-thread performance bottlenecks. The original Centip3De design is a seven-layer 3D stacked design with 128 cores and 256 Mbytes of DRAM. Silicon results show a two-layer, 64-core system in 130-nm technology, which achieved an energy efficiency of 3,930 DMIPS/W.