Fluidic self-assembly of silicon microstructures
Fluidic self-assembly of silicon microstructures
复制标题
硅微结构的流体自组装
DOI：
10.1109/ectc.1995.517853
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发表时间：
1995
期刊：
影响因子：
--
通讯作者：
J.S. Smith
中科院分区：
文献类型：
--
作者：
A. K. Verma;M. A. Hadley;H. Yeh;J.S. Smith
流体自组装是一种新技术，它使使用不同材料和工艺制造的器件的集成成为可能。通过将由一种材料制成的螺旋形块流体输送到受体基底中的类似形状的孔中来实现整合。本文对FSA集成效率进行了系统的研究。使用各向异性蚀刻由硅形成块和孔。考虑了两种不同的尺寸：尺寸为1.0 mm/spl倍/1.2 mm的大块和尺寸为150/spl mu/m/spl倍/150/spl mu/m的小块。FSA在水或甲醇中使用气泡泵装置进行再循环块。大块的FSA导致在2.5分钟内100%填充含有191个孔的基底。用小块和具有64/spl times/64孔阵列的基板进行的类似实验产生了70%的填充率，这是由于块与基板表面的不期望的粘附。粗糙化基底导致90%的填充率。还提出了一个简单的速率方程模型的FSA过程中，沿着的过程参数是重要的，以及如何可以优化的讨论。
Fluidic self-assembly is a new technique which makes possible the integration of devices fabricated using dissimilar materials and processes. The integration is accomplished by fluidically transporting trapezoidally shaped blocks made of one material into similarly shaped holes in a receptor substrate. In this paper, a systematic study of the FSA integration efficiency is presented. Blocks and holes were formed from silicon using anisotropic etching. Two different sizes were considered: large blocks of dimension 1.0 mm/spl times/1.2 mm, and small blocks of dimension 150 /spl mu/m/spl times/150 /spl mu/m. FSA was performed in either water or methanol using a bubble pump apparatus to recirculate blocks. FSA of large blocks resulted in 100% filling of a substrate containing 191 holes within 2.5 minutes. Similar experiments with small blocks and a substrate with a 64/spl times/64 array of holes yielded a fill ratio of 70%, due to undesirable adhesion of blocks to the substrate surface. Roughening the substrate resulted in a fill ratio of 90%. Also presented is a simple rate equation model of the FSA process, along with a discussion of which process parameters are important and how they can be optimized.