Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System
Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System
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DOI：
10.1149/2.1291913jes
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发表时间：
2019-09
影响因子：
3.9
通讯作者：
Xianyun Zhang;Yifan Zhang;Yanying Li;Y. Lei;Zhixiang Li;Aihua Sun;Gaojie Xu;Mingli Yu;Jianjun Guo
中科院分区：
文献类型：
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作者：
Xianyun Zhang;Yifan Zhang;Yanying Li;Y. Lei;Zhixiang Li;Aihua Sun;Gaojie Xu;Mingli Yu;Jianjun Guo
弯月面限制电沉积（MCED）已经成为用于复杂金属微结构和柔性电互连的通用增材微制造方法。迄今为止，通过MCED实现高密度和高质量互连的常见策略都集中在导电衬底上创建基于线的悬浮3D微结构，而由于不同衬底之间的过渡机制不明确，忽略了工件各部分之间的制造过程。当跨越绝缘衬底时，由于不可避免地形成双极电极（BPE），常见的双电极MCED工艺不太适合于在相邻部件的极化部分之间产生互连，这引起引线键合失效。在这里，我们描述了一种有效的方法，用于操纵双极电化学和抑制BPE引起的键合故障的MCED，通过使用双阳极系统，促进从绝缘到导电基板的顺利电化学过渡。基于这种策略，在玻璃-金过渡区成功地实现了低电阻率和高击穿电流密度（~6.56 × 1010 A/m2）的均匀互连。这种调控策略有可能扩展到其他可电化学加工的材料，用于下一代全3D打印电子和微器件，具有集成密度提高和成本降低的优点。
Meniscus-confined electrodeposition (MCED) has emerged as a versatile additive micromanufacturing method for complex metal microstructures and flexible electrical interconnections. Up to now, common strategies for high-density and high-quality interconnections by MCED are focused on creating wire-based suspending 3D microstructures on conductive substrates, and neglect the fabrication process between various parts of the workpiece due to the ambiguous transition mechanism between different substrates. When spanning across an insulating substrate, the common two-electrode MCED process is not well suited for creating interconnections between polarized portions of adjacent parts due to the inevitable formation of bipolar electrodes (BPE), which induces the wire-bonding failure. Here, we describe an effective approach for manipulating the bipolar electrochemistry and suppressing the BPE-induced bonding failures in MCED, by using a double-anode system that facilitates the smooth electrochemical transition from insulating to conductive substrates. Based on this strategy, successful demonstrations of uniform interconnections with low electrical resistivity and high breakdown current density (~6.56 × 1010 A/m2) are presented in the glass-gold transition area. This regulation strategy is potentially extendable to other electrochemical-processible materials for the next generation full 3D printed electronics and microdevices with the merits of enhanced integration density and low cost.