Biomorphic Cellular Silicon Carbide Nanocrystal-Based Ceramics Derived from Wood for Use as Thermally Stable and Lightweight Structural Materials
Biomorphic Cellular Silicon Carbide Nanocrystal-Based Ceramics Derived from Wood for Use as Thermally Stable and Lightweight Structural Materials
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源自木材的生物形态多孔碳化硅纳米晶基陶瓷，用作热稳定和轻质结构材料
DOI：
10.1021/acsanm.9b01550
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发表时间：
2019-10
影响因子：
5.9
通讯作者：
Kozo Ishizaki
中科院分区：
文献类型：
--
作者：
Jian-Fei Zhang;Xiao-Nan Zhou;Xin Huang;Liu-Cheng Hao;Qiang Zhi;Zi-Xuan Li;Bao-Qiang Hou;Jian-Feng Yang;Bo Wang;Kozo Ishizaki
以热解碳为模板，通过碳热还原法制备了超高强生物形态碳化硅（bio-SiC）多孔陶瓷。生物SiC材料中复制了各向异性的木材组织微观结构，其中几乎完全致密的细胞壁由直径为100-200纳米、长度为100-500纳米的定向柱状SiC纳米晶结构组装而成。所制备的bio-SiC陶瓷具有较高的孔隙率（76%~ 86%）、上级弯曲强度（σ|| 38.3 MPa）、高散热特性（室温下k ≤ 10.3 W·m-1·K-1）和高各向异性热导率（k ≤/k||，1.6）。取向依赖性的微观结构-性能关系可能为多功能陶瓷和复合材料的制备提供一个有前途的前景。
Ultrastrong, biomorphic cellular silicon carbide (bio-SiC) ceramics were generated by the carbothermal reduction of gaseous SiO with a pyrolytic carbon template. The anisotropic wood tissue microstructure is replicated in the bio-SiC materials, in which almost fully dense cell walls are assembled by directional columnar SiC nanocrystalline structures that are 100–200 nm in diameter and 100–500 nm in length. The resulting bio-SiC ceramics exhibited high porosity (76%∼86%), superior flexural strength to other materials (σ|| ≈ 38.3 MPa), high thermal dissipation characteristics (k⊥ ≈ 10.3 W·m–1·K–1 at room temperature), and high anisotropic thermal conductivity (k⊥/k||, ∼1.6). The orientation dependence of the microstructure–property relations may offer a promising perspective for the fabrication of multifunctional ceramics and composites.
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影响因子：
3.7
作者：
Zhenyu Liu;L. Ci;N. Jin-Phillipp;M. Rühle
通讯作者：
Zhenyu Liu;L. Ci;N. Jin-Phillipp;M. Rühle
影响因子：
9.5
作者：
Han, Meikang;Yin, Xiaowei;Cheng, Laifei
通讯作者：
Cheng, Laifei
影响因子：
5.7
作者：
Junmin Qian;Jiping Wang;G. Qiao;Z. Jin
通讯作者：
Junmin Qian;Jiping Wang;G. Qiao;Z. Jin
影响因子：
10.9
作者：
Paris, O;Zollfrank, C;Zickler, GA
通讯作者：
Zickler, GA
影响因子：
3.9
作者：
E. Vogli;J. Mukerji;C. Hoffman;R. Kladny;H. Sieber;P. Greil
通讯作者：
E. Vogli;J. Mukerji;C. Hoffman;R. Kladny;H. Sieber;P. Greil