Synthesis and thermal conductivity improvement of W-Cu composites modified with WC interfacial layer
Synthesis and thermal conductivity improvement of W-Cu composites modified with WC interfacial layer
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DOI：
10.1016/j.matdes.2017.04.090
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发表时间：
2017-08
影响因子：
8.4
通讯作者：
Chengcheng Zhang;G. Luo;Jian Zhang;Dai-Chang Yang;Q. Shen;Lianmeng Zhang
中科院分区：
文献类型：
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作者：
Chengcheng Zhang;G. Luo;Jian Zhang;Dai-Chang Yang;Q. Shen;Lianmeng Zhang
采用包覆复合粉末结合真空热压烧结的方法制备了高导热性能的WC掺杂W-Cu复合材料。采用热解法（渗碳法）对钨粉进行有机添加剂预处理，然后采用化学镀法在钨粉表面包覆铜。获得了原位生成的WC掺杂W-Cu复合材料。采用X射线衍射（XRD）、扫描电子显微镜（SEM）和透射电子显微镜（TEM）等技术对复合粉末和烧结复合材料进行了表征。结果表明，包覆后的复合粉末为W/C/Cu结构，烧结后的复合粉末为W/WC/Cu结构。W-Cu复合材料中既有Cu基体网络，又有WC界面层。与未掺杂WC的W-20wt%Cu复合材料相比，WC掺杂的W-20wt%Cu复合材料具有优异的导热系数（287.5W/（m·K））、较低的热膨胀系数（4.40ppm/k）和较高的维氏硬度（230.5HV）。其优异性能主要是由于Cu网络结构的形成及其界面层WC改善了W与Cu基体之间的结合。
In this study, the WC doped W-Cu composites with high excellent thermal conductivity were fabricated by using coated composite powders combined with vacuum hot-pressure sintering. As-received W powders were pre-modified with organic additives via pyrolysis process (carburization process), and then Cu coated by electroless plating. The WC formed in situ doped W-Cu composite was obtained. X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM) techniques were used to characterize the composite powders and sintered composites. The results show that the structure of coated composite powders was W/C/Cu and the structure of sintered sample turned into W/WC/Cu. Both Cu matrix network and WC interfacial layer were obtained in the W-Cu composite. Compared with the W-20 wt%Cu composite without WC modification, the WC doped W-20 wt%Cu composite have excellent thermal conductivity (287.5 W/(m·K)), low coefficient of thermal expansion (4.40 ppm/k) and relatively high Vickers hardness (230.5 HV). The excellent properties are mainly because of Cu network structure formed and its interfacial layer WC yielding improved bonding between the W and Cu matrix.