Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling

Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling
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DOI:
10.1109/tpel.2014.2365531
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发表时间:
2015-05
影响因子:
6.7
通讯作者:
B. Ji;Xueguan Song;E. Sciberras;W. Cao;Yihua Hu;V. Pickert
B. Ji;Xueguan Song;E. Sciberras;W. Cao;Yihua Hu;V. Pickert
中科院分区:
工程技术1区
文献类型:
--
作者:
B. Ji;Xueguan Song;E. Sciberras;W. Cao;Yihua Hu;V. Pickert

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绝缘栅双极晶体管(IGBT)功率模块广泛应用于各种功率变换应用中,其中可靠性是一个重要的问题。标准的IGBT模块是为通用应用而制造的,而几乎没有为定制应用而设计的。然而,多目标优化技术可以改进传统的IGBT设计。本文提出了一种新的设计方法来考虑短功率循环引起的贴片焊料失效和由热循环引起的基板焊料疲劳,这是IGBT的主要失效机制之一。采用高保真有限元模型对热阻进行了解析计算,得到了塑性功设计,并进行了实验验证。以塑性功和约束函数最小为目标,用代理模型表示。采用非支配排序遗传算法-II来搜索Pareto最优解和最优设计。这种结合的结果产生了一种有效的方法,以优化电力电子模块的物理结构,考虑到现场的历史环境和操作条件。
Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.