Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre
Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre
复制标题
直接芯片液体冷却可降低亚北极超级计算机中心的功耗
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Svenn A. Hanssen
中科院分区：
文献类型：
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作者：
S. Ovaska;Roy E. Dragseth;Svenn A. Hanssen
减少数据中心的电力消耗是一项及时的挑战。废热再利用是开发节能和可持续数据中心的另一个重点领域。这两个问题通过服务器机架的液体冷却和/或直接到芯片的液体冷却相互关联。这两种解决方案都可以将很大一部分废热能转移回有利可图的用途。然而，热再利用的机会并不是直接对芯片液体冷却可以提供的唯一好处。另一个好处是与服务器刀片和机架级冷却系统相关的冷却风扇相关的功耗显著降低。为了评估这一好处，我们在一个亚北极超级计算机中心托管632个刀片节点的集群进行了功耗和性能测量。我们的研究集中在一个47节点的子集上，当服务器执行LINPACK基准测试时，我们分析了这个子集。我们的结论是，直接到芯片的液体冷却可以减少总功耗，在这种情况下，高达14.4%，这取决于进气温度。
Reduction of data centre power consumption is a timely challenge. Waste heat reuse is another focus area when developing energy efficient and sustainable data centres. And these two issues are interconnected through liquid cooling of server racks and/or direct-to-chip liquid cooling. Both of these solutions make it possible to transfer a significant proportion of the waste heat energy back to profitable use. Nevertheless, the heat reusing opportunity is not the only benefit direct-to-chip liquid cooling may offer. Another benefit is the notable reduction of power consumption related to cooling fans associated with server blades and rack-level cooling systems. To evaluate this benefit, we performed power consumption and performance measurements in a subarctic supercomputer centre hosting a cluster of 632 blade nodes. Our study concentrated on a 47-node subset that we analysed when the servers were executing the LINPACK benchmark. Our conclusion is that direct-to-chip liquid cooling can reduce the total power consumption, in this case, up to 14.4% depending on the inlet air temperature.