Properties of aerosol deposited NASICON-type Li1.5Al0.5Ge1.5(PO4)3 solid electrolyte thin films
Properties of aerosol deposited NASICON-type Li1.5Al0.5Ge1.5(PO4)3 solid electrolyte thin films
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DOI：
10.1016/j.ceramint.2015.05.062
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发表时间：
2015-11-01
影响因子：
5.2
通讯作者：
Sakurai, Yoji
中科院分区：
文献类型：
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作者：
Inada, Ryoji;Ishida, Kei-ichi;Sakurai, Yoji
采用气溶胶沉积法制备了NASICON型Li1.5Al0.5Ge1.5（PO 4）（3）（LAGP）固体电解质薄膜。以不同粒度的LAGP粉末为原料，采用室温冲击固结法直接沉积在不锈钢基体上。X射线衍射分析表明，沉积态LAGP薄膜具有与LAGP粉末相同的晶体结构，沉积过程中没有第二相形成。SEM观察表明，膜由断裂的LAGP纳米颗粒组成，但孔隙率强烈地受原始LAGP粉末的平均粒径的影响。气溶胶沉积（ADed）LAGP膜在室温下的最大总（体+晶界）离子电导率为0.5 × 10（-5）S cm（-1），而膜的体电导率约为10（-4）S cm（-1），这与先前报道的LAGP的体性质相当。因此，ADed LAGP膜的较低总电导率主要归因于膜中LAGP纳米颗粒之间的大晶界电阻。提高薄膜的密度和LAGP纳米粒子之间的连接在薄膜中，应需要提高总的电导率。(C)2015 Elsevier Ltd和Techna Group S.r.l. All rights reserved.
NASICON-type Li1.5Al0.5Ge1.5(PO4)(3) (LAGP) solid electrolyte thin films were fabricated without any heat treatment by aerosol deposition (AD). Ball-milled LAGP powders with different particle sizes were used as raw material and deposited directly on a stainless steel substrate via room temperature impact consolidation. X-ray diffraction patterns revealed that as-deposited LAGP film has a same crystal structure with raw LAGP powder and no secondary phases are formed during deposition. SEM observation showed that film consists of fractured LAGP nanoparticles but the porosity is strongly influenced by an averaged particle size of raw LAGP powder. Maximum total (bulk+grain-boundary) ionic conductivity at room temperature in aerosol deposited (ADed) LAGP film was 0.5 x 10(-5) S cm(-1), while the bulk conductivity of film was approximately 10(-4) S cm(-1), which is comparable with the bulk property of LAGP as previously reported. Therefore, lower total conductivity of ADed LAGP film is mainly attributed to large grain-boundary resistance between the LAGP nanoparticles in the film. Improvement of film density and the connectivity among the LAGP nanoparticles in the film should be needed to enhance the total conductivity. (C) 2015 Elsevier Ltd and Techna Group S.r.l. All rights reserved.