Photonic BiCMOS technology — Enabler for Si-based, monolithically integrated transceivers towards 400 Gbps

Photonic BiCMOS technology — Enabler for Si-based, monolithically integrated transceivers towards 400 Gbps
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光子 BiCMOS 技术 — 实现 400 Gbps 硅基单片集成收发器的推动者

DOI:
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发表时间:
2016
期刊:
European Microwave Conference
影响因子:
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通讯作者:
A. Mai
A. Mai
中科院分区:
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文献类型:
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作者:
S. Lischke;D. Knoll;L. Zimmermann;P. Rito;A. Ulusoy;A. Awny;D. Petousi;I. Lopez;C. Mai;M. Kroh;B. Heinemann;H. Rücker;R. Barth;J. Katzer;M. Schubert;M. Kaynak;A. Mai

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通过将分段马赫-曾德尔-干涉仪调制器和高速锗光电探测器与高性能电子学相结合,提出了一种能够实现单片集成硅基收发信机前端向单波长400 Gb/S数据速率的光子BiCMOS工艺。
We present a photonic BiCMOS process enabling for monolithically integrated Si-based transceiver front-ends towards single-wavelength 400 Gb/s data rate by combining segmented Mach-Zehnder-Interferometer modulators and high-speed germanium photo detectors with high-performance electronics.