Self-assembled three dimensional network designs for soft electronics.
Self-assembled three dimensional network designs for soft electronics.
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用于软电子的自组装三维网络设计
DOI：
10.1038/ncomms15894
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发表时间：
2017-06-21
影响因子：
16.6
通讯作者：
Rogers JA
中科院分区：
文献类型：
--
作者：
Jang KI;Li K;Chung HU;Xu S;Jung HN;Yang Y;Kwak JW;Jung HH;Song J;Yang C;Wang A;Liu Z;Lee JY;Kim BH;Kim JH;Lee J;Yu Y;Kim BJ;Jang H;Yu KJ;Kim J;Lee JW;Jeong JW;Song YM;Huang Y;Zhang Y;Rogers JA
低模数、兼容的传感器、电路和无线电系统设计用于与人体软组织紧密连接，由于它们在连续的、临床质量的健康监测器和先进的生物电子疗法中的新兴应用，人们越来越感兴趣。尽管最近的研究为这类技术建立了各种材料和力学概念，但所有现有的方法都涉及组成微部件和互连的简单的二维(2D)布局。在这里，我们介绍了三维(3D)架构中的概念，这些概念绕过了传统2D设计设置的重要工程限制和性能限制。具体地说，通过确定性压缩屈曲形成的螺旋微线圈的开放网状3D互连网络为系统奠定了基础，这些系统可以在紧凑的几何形状中提供极低的弹性力学，具有活跃的组件和复杂的功能水平。耦合的机械和电气设计方法使布局优化、组装工艺和封装方案能够产生3D配置，满足要求苛刻的复杂系统的要求，例如无线、皮肤兼容的电子传感器。
Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.