Characterisation of resin-dentine interfaces by compressive cyclic loading
Characterisation of resin-dentine interfaces by compressive cyclic loading
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DOI：
10.1016/j.biomaterials.2004.07.003
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发表时间：
2005-05-01
期刊：
影响因子：
14
通讯作者：
Tay, FR
中科院分区：
文献类型：
--
作者：
Frankenberger, R;Pashley, DH;Tay, FR
本实验的目的是评价不同热载荷（TML）后树脂-牙本质界面的超形态学变化，并确定相应的微拉伸结合强度（muTBS）。从24颗人类第三磨牙上切下厚度为2mm的牙釉质/牙釉质盘，并使用四种不同粘附方式的粘合剂进行粘接：Syntac （Ivoclar Vivadent，用作多步蚀刻-冲洗粘合剂）、Clearfil SE Bond （Kuraray：两步自蚀刻粘合剂）、Xeno III （Dentsply DeTrey；混合一体化自蚀刻打印机粘合剂系统）和iBond （Heraeus Kutzer：非混合一体化自蚀刻粘合剂）。将树脂-牙本质盘切割成梁状（宽度2mm；牙本质2mm，树脂复合材料2mm），随后使用逐渐增加的机械循环次数进行循环TML， （20N， 0.5 Hz机械负荷和5-55度热循环：0/0、100/3、1000/25、10,000/250:100,000/ 2500次循环）。将加载后的样品垂直切割以测量muTBS (n = 20，十字头速度为1 mm/mm)，或将其浸泡在含有50wt%氨化硝酸银的示踪水溶液中，并使用透射电子显微镜（TEM）进行超形态学纳米渗漏检查。随着TML用量的增加，所有胶粘剂的muTBS均显著降低(p
The aims of this in vitro study were to evaluate the ultra-morphological changes in resin-dentine interfaces after different amounts of thermomechanical load (TML), and to determine the corresponding microtensile bond strengths (muTBS). Enamel/dentine discs with a thickness of 2mm were cut from 24 human third molars and bonded with four adhesives involving different adhesion approaches: Syntac (Ivoclar Vivadent, used as multi-step etch-and-rinse adhesive), Clearfil SE Bond (Kuraray: two-step self-etch adhesive), Xeno III (Dentsply DeTrey; mixed all-in-one self-etch printer adhesive system), and iBond (Heraeus Kutzer: non-mixed all-in-one self-etch adhesive). The resin-dentine discs were cut into beams (width 2mm; 2mm dentine, 2 mm resin composite) and subsequently subjected to cyclic TML using ascending amounts of mechanically hernial cycles, (20N at 0.5 Hz of mechanical load and 5-55degreesC of thermal cycles: for 0/0, 100/3, 1000/25, 10,000/250: 100,000/2,500 cycles). Loaded specimens were either cut perpendicularly in order to measure muTBS (n = 20; crosshead speed: 1 mm/mm) or were immersed in an aqueous tracer solution consisting of 50wt% ammoniacal silver nitrate and processed for ultra-morpholopeal nanoleakage examination using transmission electron microscopy (TEM). muTBS were significantly decreased by increasing amounts of TML for all adhesives (p