Thermoelectric microdevice fabricated by a MEMS-like electrochemical process

Thermoelectric microdevice fabricated by a MEMS-like electrochemical process
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DOI:
10.1038/nmat943
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发表时间:
2003-08-01
期刊:
影响因子:
41.2
通讯作者:
Fleurial, JP
Fleurial, JP
中科院分区:
材料科学1区
文献类型:
--
作者:
Snyder, GJ;Lim, JR;Fleurial, JP

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微型机电系统(MEMS)是许多快速发展的技术的基础,因为它们以低成本将微型传感器和执行器与通信和电子技术结合在一起。商业MEMS制造工艺仅限于硅基材料或二维结构。在这里,我们展示了一种廉价的电化学技术来构建类似MEMS的结构,该结构包含几种不同的金属和具有三维桥接结构的半导体。我们通过构建一个工作的微型热电设备来演示这项技术。通过重复曝光和显影多个光致抗蚀剂层,在三维结构中制备了几种不同的金属和热电材料。制作了高20μm,直径60μm的n型和p型(Bi,Sb)2Te3热电元件126个,采用桥式金属互连结构,并进行了冷却实验。这种装置对于作为冷却器运行时的精确热控制以及作为微型发电机运行时的便携式电源应该具有重要的技术意义。
Microelectromechanical systems (MEMS) are the basis of many rapidly growing technologies, because they combine miniature sensors and actuators with communications and electronics at low cost. Commercial MEMS fabrication processes are limited to silicon-based materials or two-dimensional structures. Here we show an inexpensive, electrochemical technique to build MEMS-like structures that contain several different metals and semiconductors with three-dimensional bridging structures. We demonstrate this technique by building a working microthermoelectric device. Using repeated exposure and development of multiple photoresist layers, several different metals and thermoelectric materials are fabricated in a three-dimensional structure. A device containing 126 n-type and p-type (Bi, Sb)2Te3thermoelectric elements, 20 μm tall and 60 μm in diameter with bridging metal interconnects, was fabricated and cooling demonstrated. Such a device should be of technological importance for precise thermal control when operating as a cooler, and for portable power when operating as a micro power generator.