Temperature and electric potential fields of an interface crack in a layered thermoelectric or metal/thermoelectric material
Temperature and electric potential fields of an interface crack in a layered thermoelectric or metal/thermoelectric material
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DOI：
10.1016/j.ijthermalsci.2016.01.023
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发表时间：
2016-06
影响因子：
4.5
通讯作者：
A. Zhang;Baolin Wang
中科院分区：
文献类型：
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作者：
A. Zhang;Baolin Wang
基于非线性控制方程和复变函数方法，研究了层状热电材料或金属/热电材料在热电载荷作用下的界面裂纹问题。采用电不渗透和热半渗透裂纹边界条件。得到了界面裂纹表面温度、电势和裂纹尖端热电场的显式封闭解。讨论了裂纹厚长比和裂纹内空气导热系数对裂纹尖端电流密度和热流强度因子的影响。结果表明，金属互连线与热电材料界面裂纹尖端的电流密度和热流密度强度因子远大于均质或层状热电材料。这解释了为什么热电发电/冷却器元件的失效（或微裂纹萌生）总是出现在金属电极和热电材料之间的界面处。
The interface crack problem in a layered thermoelectric or metal/thermoelectric material subjected to thermoelectric loadings is studied based on the nonlinear governing equations and complex variable method. The electric impermeable and heat semi-permeable crack boundary conditions are adopted. Explicit and closed-form solutions of temperature and electric potential on the interface crack surfaces, and crack tip thermoelectric fields are obtained. The influence of crack thickness to length ratio and thermal conductivity of air inside the crack on electric current density and heat flux intensity factors at crack tip is discussed. It is found that electric current density and heat flux intensity factors at the interface crack tip between metal interconnector and thermoelectric material are much bigger than those in homogenous or layered thermoelectric material. This explains why the failure (or microcrack initiation) of a thermoelectric generation/cooler element always appears at the interface between the metal electrode and thermoelectric material.