BiNV bond: A hole-transfer bridge for high-efficient separation and transfer of carriers.
BiNV bond: A hole-transfer bridge for high-efficient separation and transfer of carriers.
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DOI：
10.1016/j.jcis.2021.01.043
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发表时间：
2021-01
影响因子：
9.9
通讯作者：
Yuhong Wang;Wenjun Jiang;Wei‐Jing Yao;Zailun Liu;Zhe Liu;Yajun Wang;Li-jie Shi;Li-Zhen Gao
中科院分区：
文献类型：
--
作者：
Yuhong Wang;Wenjun Jiang;Wei‐Jing Yao;Zailun Liu;Zhe Liu;Yajun Wang;Li-jie Shi;Li-Zhen Gao
Addressing the inherent holes transport limitation of BiVO4photoanode is crucial to achieve efficient photoelectrochemical (PEC) water splitting. The construction of the hole-transfer bridge between co-catalysts and BiVO4photoanode could be an effective way to overcome sluggish hole-transfer kinetics of BiVO4photoanode. Herein, CxNy/BiVO4photoanode was prepared by coupling carbon nitride hydrogel (CNH) containing unsaturated N on the BiVO4photoanode during annealing. CxNy/BiVO4photoanode exhibited excellent PEC performance and stability. Photoelectrochemical tests proved that the coupling of CxNyaccelerated holes transfer and enhanced oxygen evolution kinetics. X-ray photoelectron spectroscopy (XPS) and theoretical calculations confirmed the existence of the Bisingle bondNsingle bondV bond between BiVO4photoanode and CxNy, which could serve as the hole-transfer bridge to significantly accelerate separation and transfer of carriers driven by the interfacial electric field. Moreover, it was found that the coupling of CxNyeffectively inhibited the dissociation of metal ions through changing their coordination environment, resulting in the excellent stability of CxNy/BiVO4photoanode. This result provides unique insights into vital roles of the interfacial structure, which might have a significant impact on the construction of PEC devices.
