Sensing and actuating behaviours of piezoelectric layers with debonding in smart beams
Sensing and actuating behaviours of piezoelectric layers with debonding in smart beams
复制标题
智能梁中压电层脱粘的传感和驱动行为
DOI：
10.1088/0964-1726/10/4/315
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发表时间：
2001
期刊：
影响因子：
--
通讯作者：
S. Atluri
中科院分区：
文献类型：
--
作者：
L. Tong;Dongchang Sun;S. Atluri
本文提出了一种分析模型，用于研究压电致动器/传感器和主机梁的传感和致动行为之间的脱粘的影响。在该模型中，采用经典梁理论，同时考虑了主梁和压电层的弯曲和纵向位移。对于粘合剂层，仅考虑贯穿厚度的剥离应变和横向剪切应变，并且假设它们在整个粘合剂厚度上是恒定的。当主机梁和致动器或传感器之间发生脱粘时，假设通过粘合剂层传递的应力为零。使用这个模型，剥离的影响上的传感和致动行为进行检查。数值结果表明，脱粘对结构的应变、内力分布、频谱和装药输出有显著影响。
This paper presents an analytical model for investigating the effect of debonding between piezoelectric actuators/sensors and the host beam on the sensing and actuating behaviour. In this model, both flexural and longitudinal displacements of the host beam and the piezoelectric layers are considered using classical beam theory. For the adhesive layer, only through-thickness peel strain and transverse shear strain are taken into account, and they are assumed to be constant across the adhesive thickness. When a debonding occurs between the host beam and an actuator or sensor, the stresses transferred via the adhesive layer are assumed to be zero. Using this model, the effects of debonding on the sensing and actuating behaviour are examined. Numerical results reveal that debonding can have remarkable effects on the distributions of strains and internal forces as well as frequency spectrum and charge output.