Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation
Advances in thermal interface technology: mono-metal interconnect formation, processing and characterisation
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热界面技术的进步：单金属互连的形成、加工和表征
DOI：
10.1109/itherm.2010.5501343
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
H. Reichl
中科院分区：
文献类型：
--
作者：
B. Wunderle;M. Klein;L. Dietrich;M. A. Ras;R. Mrossko;D. May;R. Schacht;H. Oppermann;B. Michel;H. Reichl
随着对新热技术和材料的需求多年来不断增加，为下一代电力电子、微处理器和高功率光学系统提供热解决方案，热表征方法也必须在分辨率和精度方面跟上这一发展的步伐。我们已经开发了大块和界面技术，以减少使用Ag和au基材料的热阻，以及低t和低p工艺，使其符合电子工业的要求。本文研究了产生纳米增强表面结构以及热压键合的新工艺。随着这些过程，特别设计的试验台描述了能够提取技术进步所取得的效果。
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. We have developed both bulk and interface technologies to reduce thermal resistance using Ag and Au-based materials and low-T and low-p processes to render them eligible for the electronics industry. New processes to generate nano-enhanced surface structures as well as thermo-compression bonding are examined within this paper. Along with these processes especially designed test stands are described which are able to extract the effects achieved by the technological advances.