Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles
Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles
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DOI：
10.1016/j.colsurfa.2018.02.056
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发表时间：
2018-05
期刊：
影响因子：
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通讯作者：
S. Yokoyama;I. Suzuki;K. Motomiya;Hideyuki Takahashi;K. Tohji
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文献类型：
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作者：
S. Yokoyama;I. Suzuki;K. Motomiya;Hideyuki Takahashi;K. Tohji
柠檬酸稳定的铜（Cu）纳米粒子（NPs）沉积在铟锡氧化物（ITO）基板上使用水性电泳沉积（EPD）。通常，Cu NP在水溶液中是不稳定的，因为它们容易氧化和聚集，这就是为什么之前没有使用水性EPD将它们存款在基底上的原因。然而，我们表明，在水溶液中使用柠檬酸处理Cu NPs去除了表面氧化物并充分稳定了表面。在处理后，Cu NP即使在一周后在水溶液中也保持高度稳定，并且这种稳定性在水溶液中的电场下得以维持。通过水性EPD以随电流密度增加的沉积速率（在0.10、0.20和0.30 mA/cm 2下分别为0.25、0.46和0.96 mg/cm 2/min）将Cu NP快速沉积在ITO基底上。以0.30 mA/cm 2电流密度快速沉积的Cu NP薄膜含水量过高，导致薄膜开裂，致密度低。相反，我们证明了0.20 mA/cm 2的电流密度导致均匀和高密度的Cu NP膜。
Citric-acid-stabilized copper (Cu) nanoparticles (NPs) were deposited on indium tin oxide (ITO) substrates using aqueous electrophoretic deposition (EPD). Usually, Cu NPs are unstable in aqueous solution because they oxidize and aggregate easily, which is why aqueous EPD has not been used before to deposit them on substrates. However, we showed that treating Cu NPs using citric acid in aqueous solution removed surface oxides and stabilized the surfaces sufficiently. After the treatment, the Cu NPs remained highly stable in aqueous solution even after one week, and this stability was sustained under an electric field in aqueous solution. The Cu NPs were deposited rapidly on ITO substrates by aqueous EPD at a deposition rate that increased with current density (0.25, 0.46, and 0.96 mg/cm2/min at 0.10, 0.20, and 0.30 mA/cm2, respectively). The Cu NP films obtained by the rapid deposition at 0.30 mA/cm2contained too much water, leading to cracked and low density films. Instead, we demonstrated that a current density of 0.20 mA/cm2resulted in uniform and high density Cu NP films.