CERAMIC AND GLASS-CERAMIC PACKAGING IN THE 1990S
CERAMIC AND GLASS-CERAMIC PACKAGING IN THE 1990S
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DOI：
10.1111/j.1151-2916.1991.tb04320.x
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发表时间：
1991-05-01
影响因子：
3.9
通讯作者：
TUMMALA, RR
中科院分区：
文献类型：
--
作者：
TUMMALA, RR
广泛的概述封装涉及互连，供电，保护和冷却半导体芯片，以满足各种计算机系统的需要。 陶瓷在其热，机械，电气和尺寸控制要求方面的一般要求，提出了高性能和低性能的应用。 玻璃陶瓷被认为是高性能系统的最佳候选材料，氮化铝、氧化铝或莫来石被认为是低性能系统的最佳候选材料。 玻璃陶瓷/铜基板技术作为一个例子，在20世纪90年代使用的高性能陶瓷封装进行了讨论。 到2000年，具有或不具有聚合物和多孔性的低介电常数陶瓷，例如二氧化硅、硼硅酸盐和堇青石的复合物，被预测为潜在的陶瓷基底材料。
A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high-performance and low-performance applications. Glass-ceramics are identified as the best candidates for high-performance systems, and aluminum nitride, alumina, or mullite are identified for low-performance systems. Glass-ceramic/copper substrate technology is discussed as an example of high-performance ceramic packaging for use in 1990s. Lower-dielectric-constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.