Highly anisotropic thermally conductive polyimide composites via the alignment of boron nitride platelets
Highly anisotropic thermally conductive polyimide composites via the alignment of boron nitride platelets
复制标题
通过氮化硼片排列的高度各向异性导热聚酰亚胺复合材料
DOI：
10.1016/j.compositesb.2018.09.104
复制
发表时间：
2019-02-01
影响因子：
13.1
通讯作者：
Zhang, Qiuyu
中科院分区：
文献类型：
--
作者：
Wang, Haitao;Ding, Dongliang;Zhang, Qiuyu
在这项工作中，通过“球磨、高压压缩和低温烧结”的简单方法成功制备了高各向异性导热聚酰亚胺/氮化硼（PI/BN）复合材料。含30wt%BN的PI复合材料的面内导热系数高达2.81 W/mK，面外导热系数为0.73 W/mK，分别约为纯PI的3.2倍和2.4倍。导热率的大幅提高归因于BN片晶的面内排列，从而构建了高度连接的导热路径。与面外方向相比，面内方向的导热BN网络更加致密和充分，更有利于散热。
In this work, highly anisotropic thermally conductive polyimide/boron nitride (PI/BN) composites were successfully prepared by a simple method called "ball milling, high-pressure compression and low-temperature sintering". The in-plane thermal conductivity of the PI composites with 30wt% BN reached as high as 2.81 W/mK, while the out-of-plane thermal conductivity was 0.73 W/mK, about 3.2 times and 2.4 times of pure PI, respectively. The great improvement of the thermal conductivity was attributed to the in-plane alignment of BN platelets, which constructed highly connected thermally conductive pathways. The thermally conductive BN networks were observed to be more dense and sufficient in the in-plane direction, more favorable for the heat dissipation, compared to the out-of-plane direction.