A novel method for IR-drop reduction in high-performance printed circuit boards
A novel method for IR-drop reduction in high-performance printed circuit boards
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DOI：
10.1109/icept.2014.6922723
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发表时间：
2014-10
期刊：
影响因子：
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通讯作者：
Yue-Hui Huang;Mu-Shui Zhang;Hongzhou Tan
中科院分区：
文献类型：
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作者：
Yue-Hui Huang;Mu-Shui Zhang;Hongzhou Tan
在本文中，我们研究了高性能多层印刷电路板（PCB）的IR降问题。自适应网格用于简化流程并提高效率。研究发现，电压调节器模块 (VRM) 的过孔接触和铜平面都会产生显着的 IR 压降。提出了一种减少IR压降的新方法，该方法可以显着降低VRM和铜平面的通孔接触引入的电阻。这种方法可以降低IR drop约50%。此外，我们还讨论了多平面结构的IR降降低。通过合理的设计规则，电流需求为100+A的PCB的IR压降可以保持在几十毫伏以内。
In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.