A Micromachined Nano tweezers Integrated with a Thermal Expansion Micro Actuator
A Micromachined Nano tweezers Integrated with a Thermal Expansion Micro Actuator
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集成热膨胀微执行器的微机械纳米镊子
DOI：
10.1541/ieejsmas.123.1
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发表时间：
2003
影响因子：
--
通讯作者：
H. Fujita
中科院分区：
文献类型：
--
作者：
G. Hashiguchi;T. Fukino;T. Hara;Jyunya Miyake;K. Kakushima;M. Ataka;H. Fujita
利用电感耦合等离子体反应离子刻蚀装置（ICP-RIE）刻蚀30μ m厚的绝缘体上硅晶片（SOI），设计了一种集成热膨胀微致动器的新型微机械纳米镊子。为了获得小于10 nm的针尖半径和对准两个探针针尖，设计了新的工艺序列，将硅的湿法各向异性刻蚀与ICP-RIE相结合。两个探针针尖之间的差距可以通过集成的硅热膨胀致动器来控制，该致动器长500 μm，宽50μm，厚30μm。由于探针尖端的位移在机械上被放大为热膨胀位移的5倍，因此当向热膨胀致动器施加0.4 W时，观察到朝向相对探针尖端的2µm位移，这与理论预测定量一致。艾德。
We have developed a new micromachined nano tweezers integrated with thermal expansion micro actuators.The device structure was de.ned by etching of a 30µm-thick silicon-on-insulator wafer (SOI) using an inductively coupled plasma reactive ion etching apparatus (ICP-RIE). To obtain the tip radius of less than 10nm and to align two probe tips, new process sequence was designed by combining wet anisotropical etching of silicon with the ICP-RIE. The gap between the two probe tips can be controlled by the integrated Si thermal expansion acutuators which are 500µm in length, 50µm in width, and 30µm in thickness. Since the displacement of the probe tip is mechanically magni.ed by 5 times as the thermal expansion displacement, 2µm displacement toward the opposing probe tip was observed when 0.4 W was applied to the thermal expansion actuator, which quantitatively agreed with theoretical prediction.