Design considerations of silicon avalanche cathodes
Design considerations of silicon avalanche cathodes
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DOI:
10.1116/1.586876
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发表时间:
1993-03
影响因子:
1.4
通讯作者:
M. Wang;Yicheng Lu;B. Lalevic
中科院分区:
文献类型:
--
作者:
M. Wang;Yicheng Lu;B. Lalevic
Silicon avalanche cathodes using ultrashallow p–n junction have been used as a current source in vacuum microelectronics and have shown promising potential for device applications. In this article, device simulation results with a two‐dimensional, two‐carrier device modeling program which simultaneously solves Poisson’s and both the electron and hole continuity equations are presented. The simulation includes impurity concentration and electric field dependent mobility models, impurity concentration dependent Shockley–Read–Hall and Auger recombination, band gap narrowing, and impact ionization model. Due to the small vertical dimension of the n‐type shallow channel, the nonplanar surface structure resulting from subsequent processing steps influences the device performance. The simulation results indicate locations of current crowding in our prototype devices. In order to achieve maximum emission current density, it is very important to obtain a uniform emission across the entire emitter areas. The design...