Laser direct structuring creates low-cost 3D integrated circuits
Laser direct structuring creates low-cost 3D integrated circuits
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作者：
D. Gries
激光直接成型（LDS）是一种已经建立的技术，通过使用激光和金属化步骤来创建用于注塑塑料上的表面安装组件的电路和着陆，从而创建三维模塑互连器件（3D-MID）。
An already established technology, laser direct structuring (LDS) creates three-dimensional molded interconnect devices (3D-MIDs) by using a laser and metallization steps to create electrical circuits and landings for surface-mount components on injection-molded plastics.