The technology combined electrochemical mechanical polishing

The technology combined electrochemical mechanical polishing
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DOI:
10.1016/s0924-0136(03)00826-4
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发表时间:
2003-09
影响因子:
6.3
通讯作者:
Yuanting Chen;Shun Zhu;Shuo-Jen Lee;Jong-C. Wang
Yuanting Chen;Shun Zhu;Shuo-Jen Lee;Jong-C. Wang
中科院分区:
材料科学1区
文献类型:
--
作者:
Yuanting Chen;Shun Zhu;Shuo-Jen Lee;Jong-C. Wang

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电化学机械抛光(ECMP)是一种综合了电化学和机械作用的抛光工艺。它具有更高的效率和更好的质量。介绍了该工艺的机理、工艺规程及应用情况。
Electrochemical mechanical polishing (ECMP) is a polishing process combining electrochemical and mechanical action. It has higher efficiency and better quality. Mechanism, processing regulation and application are introduced in the paper.